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Silicone Heat Sink Compound SI/HSC/10

Heat Sink Compound

Colour and Consistency:

White, Opaque

Specific Gravity:

1.6

Maximum Percent Bleed (after 30 Hrs. @ 200°C):

3%

Maximum Evaporation (after 24 Hrs. @ 200°C):

2%

Thermal Conductivity (K factor):

0.0010 cal/cm²/°C/sec/cm

Main Application:

Heat Sink Compound is applied to the base and mounting studs of transmission and diodes. It maintains a positive heat sink seal that improves heat transfer from the devices to the heat sink or chassis. It is widely used in semiconductor technology.